2017-08-07

Bourns, a leading global supplier of electronic components, announced the addition of a new force to its award-winning Multifuse products - AEC-Q200 certified high temperature polymer polymer positive temperature coefficient (PPTC) self-healing fuse.

2017-06-19

GLOBALFOUNDRIES announces the introduction of its FX-7 ™ ASIC (Application Specific Integrated Circuits) using a 7nm FinFET process. The FX-7 is an integrated design platform that combines state-of-the-art process technology with differentiated intellectual property rights and 2.5D / 3D packaging technology to deliver the industry's most complete portfolio of data centers, machine learning, automotive, wireline communications and 5G wireless applications s solution.

2017-06-19

Maxim announced the MAX20078 Synchronous Buck, High Brightness LED Controller, the industry's only component that provides both fast response time and low EMI (EMI) for external LED lighting and improved safety applications. The LED controller can be used for matrix lighting design, providing designers with high-performance, simple design, and can quickly market solutions.

2017-06-19

Silicon Labs (also known as "Core Technology") has introduced a new multi-band SoC that supports full Bluetooth 5 connectivity and more storage capacity options to further expand its Wireless Gecko system single-chip (SoC) product line.

2017-06-16

Qorvo, Inc., a provider of innovative RF solutions for the interconnected world, today announced the industry's smallest sound wave (BAW) filter, the QPQ1300, which handles an average 5W RF input power with a peak power of 40W.

2017-06-15

ON Semiconductor's KAI-29052 is available in a CPGA-72 package that conforms to the Restriction of Hazardous Substances Directive (RoHS), with black and white, Bayer and Sparse Color configurations, and with the existing KAI-29050 image sensor and a full range of 5.5 Micron and 7.4 micron CCD image sensor are fully pin compatible, enabling camera manufacturers to quickly adopt new components.

2017-06-15

Toshiba Semiconductor and Storage Products announced two new "TC3567CFSG" and "TC3567DFSG" leading industry [1] to achieve lower current consumption than the plateau [2] and enhance the safety communication function. These two ICs are Toshiba's latest members of Bluetooth-enabled low power (LE) [3] ver.4.2 communication chips. The sample is available.

2017-06-15

​According to foreign media reports, today, Intel announced that it will invest $ 178 million in Bangalore, India, the new one of the most advanced design and research and development center. The center will be located in Intel's 44-acre headquarters, covering an area of about 620,000 square feet, responsible for the design and verification of the chip.

2017-06-14

On the morning of June 13, the total investment of 35 billion yuan Wuhan Huaxing photoelectric 6th generation flexible LTPS-AMOLED production line (Huaxing photoelectric t4 project), in the optical Valley intelligent manufacturing industry park started.

2017-06-14

Today announced the availability of its 7nm lead performance (7LP) FinFET semiconductor technology, with 40% of the leapfrog performance boost to meet the needs of applications such as high-end mobile processors, cloud servers and network infrastructures. Design Suite is now ready, based on 7LP technology, the first batch of customer products is expected to launch in the first half of 2018, and will be the second half of 2018 to achieve mass production.